EVAN 3D SERIES

EVAN 3D SERIES

Designed for 3D surfaces, this laser marking system enables deep, permanent engravings on complex geometries.

Model : Evan-30 3DD / Evan-50 3DD / Evan-100 3DD
Wavelength : 1064 nm
Cooling : Air Cooled

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Product Description

Designed for 3D surfaces, this laser marking system enables deep, permanent engravings on complex geometries. Ideal for industrial tools, molds, and customized products, it delivers high-precision, durable results on metals, plastics, and composite materials.

Product Features

Marking on 3D deep & Curved Surface

Marking on variable height surface at a time

3D depth engraving on Metals for Die and Mould application

Bitmap (Graphics) marking

High quality gray scale marking.

Long using time : the average using time more than 100000 hours.

Good stability and free maintenance: No need to do maintenance for laser device.

Stable performance, small size, low power consumption.

The operating system is flexible and convenient.

Excellent beam quality, high stability output easy to debug the marking effect.

High speed marking (MHz repetition rate).

First and last pulse equally useable.

High repeatability/stability design.

Status monitoring and safe shut down.

High electro-optical conversion efficiency, long useful period.

Technical Specification

Model Evan-30 3DD Evan-50 3DD Evan-100 3DD
Output Power 30 W 50 W 100 W
Wavelength 1064 nm
Power Adjustment 0 to 100 %
Cooling Air Cooled
Min. Line Width Min. 0.03 mm (Depend on Material)
Max. Speed Max. 10000 mm/s (Max. Linear Speed)
Marking Depth 0.01~0.3mm (Depends on Material)
Min Character Height 0.5 mm
Marking Range 145 mm X 145 mm (Standard) Optional : 200 x 200 mm
Supporting Format Support STL, PLT, DXF, BMP File etc., Using SHX TTF Character Storage Directly
Single Pulse Energy (mj) 1.0@30KHz 1.0@50KHz 1.0@100KHz
Repetition Frequency Range 30-60 KHz 50-100 KHz 20-200 KHz
Output Power Stability <3%
Beam Quality(M2) <1.5 <1.8
Max Power Consumption 1 KW

Specifications are liable to change without prior notice.

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